1. The number of layers: 2-18 layers of circuit board (rigid), soft and hard combined board, metal substrate, high-frequency board
2. Material: FR-4 (containing high TG, high CTE) high frequency material (containing PTFE, PI, BT, Rogers, etc.) metal based material
3. Processing characteristics: blind hole/buried hole plate characteristic impedance control board HDI board thick copper plate soft and hard combined with plate high frequency plate, metal substrate gold finger plate can be peeled blue rubber plate countersunk hole resin plug hole
4. Surface treatment: Hot air leveling chemical nickel gold chemical tin chemical silver surface anti-oxidation lead-free spray tin nickel palladium
5. Application: consumer electronics, communications, industrial control equipment, computers and peripheral equipment, automotive electronics, medical equipment, power supply